Speaker 0:  magnetoresistive random access memory. is this the future of next generation ram, john?

Speaker 1:  i don't know. and this one was kind of difficult for me to, to wrap my head around. but let's let's dive into it. say so they've developed what's called a multiferroic heterostructure, which is for mram. sorry. and what that does is it significantly reduces energy consumption during data writing. so the design that they did is it designed it it encaptures a bandium buffer layer between ferromagnetic and piezoelectric materials. and what that does is it enables electric field control magnetization switching instead of the traditional current driven methods, which apparently cuts energy use by orders of magnitude. so the key innovation here is that vanadium layer that stabilizes magnetization direction fluctuations, and that allows reliable switching at one volt with minimal heat, which addresses mram's historical trade off between stability and energy efficiency. so this is interesting. it's it's interesting. what are your thoughts on this?

Speaker 0:  well, the concept is great. it's kinda like e ink for lack of a better thing for your ram. it's turned on or turned off, and then it's just left.

Speaker 1:  yeah. yeah. and, like yeah. so, like, the vandy of layer, it's don't think of it like a buffer. it's more like a stabilizer. so what it does is it helps to dampen thermal noise that previously caused erratic magnetization, which, which enables reliable local to switching. so think of it like a shock absorber for this. so this is really cool.

Speaker 0:  and, apparently, it's way faster.

Speaker 1:  yeah. apparently, it is. so, i know that, i think nvidia and tsmc are exploring m and m, and then there's other advancements with imex, sot mram. so there's a bunch of different, innovations here going on, computing technologies, which shows that this is worthwhile or this is a viable, next step. right?

Speaker 0:  yeah. and the concept of integrating, you know, this is nonvolatile storage. you know, it's faster. it's enhanced durability, just because of the way it works. yeah. and, yeah, it seems great. the startup performance provides immediate data access on power up because, you know, the dram doesn't need it's already ready.

Speaker 1:  yeah. yeah. so yeah. go ahead.

Speaker 0:  we'll have to see, as how quickly modern commercial computer systems start, adapting this. but, you know, if they're it would extend their system lifetime, reduce, like you said, thermal dispensation, faster boot up times, and enhance our liabilities. you know? imagine these types of things in your tablet devices, right, where you reboot, but the memory just stays so it comes back to exactly where you were.

Speaker 1:  yeah. exactly. and just to put it into perspective, this is essentially what they're saying. it's a thousand times more efficient than conventional ram. so that's crazy.

Speaker 0:  yeah. you know, just imagine what we could do with edge computing applications at a thousand times the speed, ai accelerations, faster model training, reduce energy cost, improve inferencing. you know, they're talking about building those, multibillion dollar ai data centers with and using nuclear power to power them. we really need to take as much of this energy efficiency as possible. you know, low power devices that'll extend battery life, smaller device footprint, instant wake functionality, and data persistence across, reboots and stuff. so yeah. the advances are significant. what are some of the challenges to, getting it in my hand?

Speaker 1:  well, there's there's definitely some scalability challenges. there's production. there's there's, i think, i don't know if they've tested the, the durability of it. i couldn't find anything, but what did you find as far as challenges?

Speaker 0:  long term performance concerns, time based degradation. studies have not comprehensively tested that mram cells might, degrade over extended period of time. environmental factors, the impact of temperature variations, elect electromagnetic inference, interference, and other environmental conditions require further investigation. scaling questions remain about how performance characteristics might change as manufacturing scales to meet commercial demand, right cycle limitations, error rates over time, recovery mechanisms, and manufacturing and integration challenges, production complexity. the multi heroic heterostructure design involves sophisticated manufacturing process that must be optimized for cost effective mass production. so it's gonna take a while. yeah. and then compatibility and integration with existing existing systems with current computing architectures require careful, integration design and standardization. and all this has to go through that process to get yield rates to a level where, you're producing a consistent, product that actually works. right? you would talk about, you know, chip rates failing and all that kind of stuff. so yeah. and then, you know, market adoption, establish infrastructure, cost consideration, and industry standard. so when the market moves. so they'll have to get you the yield rates down to a good, level, and then somebody big is gonna have to make the move first.

Speaker 1:  yeah. and as long as they make it somewhat compatible with or make it easy for, for electronics manufacturers to integrate it, then, yeah, it's it's a no brainer kinda thing, but we'll have to see.

Speaker 0:  so let us know what you think. are you, ready for this? or do you think this is another, pipe dream where memory this is a technology we're not gonna see for a long, long time? i'd love to see this in my hand soon because, it looks like it's a great technology, faster, more efficient. we should, be looking at this a lot if it actually works.

Speaker 1:  yeah.